Incapsulaggio

Silcoset 101 pottingThe practice of encapsulating and potting electronic components is a well established process designed to protect delicate circuitry.  This protection may be required for a number of reasons:-

  • Mechanical shock
  • Thermal shock
  • Vibration
  • Chemical attack
  • Humidity
  • Extreme temperatures
  • Wide thermal cycles

In addition to providing protection, the encapsulant may also be used to perform other functions, such as thermal transfer and light emission.

Although the end function may appear simple and straightforward the operating conditions, component design and production methods often place heavy demands on the encapsulant and require very meticulous product selection and testing.  There are a variety of materials on offer including polyurethanes, epoxies, silicones and many other polymers, each system will have advantages as well as limitations.  It is therefore, important to fully understand the chemical and physical properties of each system and carefully match these to the requirements of the component and manufacturing processes.

For specific infomation on encapsulation refer to the following pages

Silicone encapsulants

Silicone gels

Thermal transfer

 

ACC Silicones Ltd, Amber House, Showground Rd, Bridgwater, TA6 6AJ
Tel: +44 (0) 1278 411400 Fax: +44 (0) 1278 411444